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Home > 2004 > Januar > 14 > ESEC - Die attach and wire bonding solutions

ESEC - Die attach and wire bonding solutions

ESEC is a leading global provider of chip assembly equipment and system solutions for the semiconductor industry. The company's core business activities is die attach (Die Bonder Flip Chip Bonder) and wire bonding.


eingetragen am: Mittwoch, 14.01.2004

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